兰斯8攻略

產品技術

Products

封裝品種

您當前位置:首頁|產品技術|封裝品種

 
DIP series

Production Overview

 

   DIPDual-In-line packages have been an industry standard for a long time. The applications are common in consumer products, automotive devices, memory, analog ICs, and microcontrollers. These packages have evolved into a state-of-the-art technology owing to their robust reliability and great improvement on performance. Using TH ( through hole) and assembly, DIP provide an assortment of packaging capabilities, especially in low pin count devices at competitive manufacturing costs.

 

Key Features

 


 PKG TYPE

DIP300mil

DIP400mil

DIP600mil

DIP750mil

Lead Count

8~24

28/32

24/28/42/48/52

64/88

LF Material

Cu

Cu

Cu

Cu

Body Width

(mm) * (mm)

7.62

10.16

15.24

19.05/19.50

Body Thickness

3.30

3.30/3.80

3.81

3.80

Lead pitch (mm)

2.54/1.778

1.778

2.54/1.778

1.778/1.27


(1mm=39.37mil; 1mil=25.4um)
* The width of DIP is the distance of shoulder-to-shoulder.


 

Reliability Test Standards

The test criterion is zero defect out of 77 sampling units.


Temp/Humidity Test

85°C/ 85% RH,  JEDEC 22- A101

Pressure Cooker Test

121°C/ 100% RH/ 15 PSIG, JEDEC 22- A102

Temp Cycle Test

-65 ~ 150°C, JEDEC22-A104

High Temp Storage Test

150°C, JEDEC 22- A103

High Accelerated Stress Test

130°C/ 85% RH/ 33.5 PSIA, JEDEC 22- A110/A118


 

 

?

CopyRight 2015 All Right Reserved Tongfu Microelectronics Co., Ltd.
地址:江蘇省南通市崇川路288號 電 話:0513-85058888 傳 真:0513-85058868
備案號:蘇ICP備05003519號

兰斯8攻略 法兰克福对本菲卡 新剑侠情缘3官网 斯图加特市区 北京快乐8 官网 2001太空漫游 下载 快乐10分开奖结果云南 古怪猴子网站 天天飞车涡轮 火箭vs勇士全场视频回放 不来梅对霍芬海姆赛果 贵州11选5走势 时时彩走势图怎么分析 大逃杀投注 热那亚vs 猎鱼达人老版本 巴列卡诺vs马竞的比分预测